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Global Market Watch: YMTC Surpasses Micron to Become Third Largest NAND Producer in Global Shipment
Chinese NAND maker Yangtze Memory Technologies (YMTC) moved into third place globally by shipment share for the first time, overtaking Micron; Quanta…
16 hrs ago
4
Global Market Watch: Pegatron Q2 Profit Balloons 14x, Driven by AI
Foxconn said its next-generation Nvidia Vera Rubin AI rack platform is entering mass-production readiness in Q3; Pegatron reports Q2 net profit up more…
Aug 13
4
Global Market Watch: TSMC's CoWoS Achieves Good Yields Above 98%
TSMC said CoWoS has entered 5.5x reticle-size mass production with AI customer yields above 98%, targeting 14x reticle size by 2029; Good news for…
Aug 12
5
1
Exclusive Interview with UK Semiconductor Center CEO Andy McLean
Redefining UK-Taiwan Synergy in System Integration to Accelerate AI Infra Delivery
Aug 11
•
Judy Lin 林昭儀
3
1
1
Global Market Watch: TSMC Reportedly Expands CoPoS Capacity with AUO Fab Purchases
TSMC reportedly buying two AUO fabs to expand CoPoS capacity; Nanya, ADATA, and Phison all posted record July revenue; Southern Taiwan employers posted…
Aug 10
2
Global Market Watch: TSMC Publishes Monolayer MoS2 Transistor Breakthrough With NYCU
TSMC’s breakthrough paper on Monolayer MoS2 transistors demonstrates its strategy to hedge against silicon scaling limits well ahead of commercial…
Aug 7
2
1
How Solace Enables Cutting-Edge Fab Operations on Real-Time Events
The Canadian enterprise software and data movement company innovates on solutions for Event-Driven Manufacturing
Aug 7
4
Global Market Watch: Taiwan Memory Chip Firm Nanya Technology Commits US$10.8 Billion Fab Investment
Mega-scale AI infrastructure investments, record-breaking corporate revenues, and escalating technology trade tensions dominated today's news…
Aug 6
2
The Semiconductor Risk Triangle: Vincent DeGiorgio on Fabs, Onshoring Bottlenecks, and AI
From US regulatory friction to the perils of unvalidated AI, risk engineering pioneer Vincent DeGiorgio shares why capturing unwritten fab wisdom is…
Aug 6
•
Judy Lin 林昭儀
6
Dr. Change Column #6: The Battle for Compute: America vs. China’s Top 20 Unicorns of 2026
What the global clash for AI power means for Taiwan’s tech future.
Aug 5
•
Dr. Change (CY Huang)
4
Global Market Watch: TSMC and Intel Push CoPoS Glass Substrate Packaging Toward Commercialization
TSMC and Intel are advancing CoPoS (Chip-on-Panel-on-Substrate) glass substrate packaging; Intel’s EMIB-T advanced packaging yield has reportedly…
Aug 4
2
Global Market Watch: TSMC’s 3nm Expansion Outpaces Expectations
Strong demand from AMD, Broadcom, and Nvidia is driving the scale up.
Aug 3
3
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