Industry Spotlight: UMC Secures Qualcomm’s Advanced Packaging Orders? Opportunities and Challenges
United Microelectronics Corp (UMC) has reportedly secured advanced packaging orders from Qualcomm, targeting AI PC and automotive CPUs. According to reports from Taiwan’s Economic Daily and Commercial Times, UMC will utilize its Wafer-on-Wafer (WoW) Hybrid Bonding technology for these orders, signaling a major s…
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